Damnang

For this expert call, I spoke with a former ASML EUV engineer. We explored the topics below in depth. I encourage you to give it a read, and I’m confident you’ll come away with valuable insights. 1. The technology What EUV is, how it differs from DUV, and what sets High NA and Hyper NA apart. 2. The economics What goes into delivering and installing a system, how long the process takes, and the economic strengths and limitations of ASML’s EUV technology moat. 3. China’s semiconductor industry Whether China can develop its own EUV systems, and his views on concerns about future oversupply from China. 4. Terafab How Elon Musk might secure EUV systems, and whether Terafab can succeed.

Semiconductor equipment makers form the foundation of the chip industry. This article explores both the technology behind EUV and the economics of the semiconductor equipment industry. It also offers deeper insights into the future of China’s semiconductor industry and how Terafab could take shape. If you want to better understand the semiconductor industry, I highly recommend giving it a read.

In the long run, only companies that control their own compute infrastructure, develop their own AI models, and design their own chips will survive.

I’ve discussed this several times, including in my previous interview with a hybrid bonding expert. So why do people keep messaging me to ask if hybrid bonding really isn’t going to happen? Is there something prompting these questions? Based on what the expert said, my understanding is that hybrid bonding will be adopted before 2030 and that technical preparations are already underway.

Can Elon Musk really get EUV systems into Terafab? How does a former ASML EUV engineer think he could make it happen? Read the article to the end, and I think you’ll come away with a clearer understanding of that strategy and the bigger picture behind Terafab.